WebSep 30, 1998 · ABSTRACT. Several aspects of a new silicon‐on‐insulator technique utilizing bonding of oxidized silicon wafers were investigated. The bonding was achieved by heating in an inert atmosphere a pair of wafers with hydrophilic surfaces contacted face‐to‐face. A quantitative method for the evaluation of the surface energy of the bond … WebDec 4, 2009 · Abstract: In this study, we demonstrate near-ballistic uni-traveling carrier photodiodes (NBUTC-PDs) with an optimized flip-chip bonding structure, wide 3-dB optical-to-electrical (O-E) bandwidth (> 110 GHz), and extremely high saturation current-bandwidth product performance (37 mA, > 110 GHz, > 4070 mAmiddot GHz). NBUTC …
Extremely High Saturation Current-Bandwidth Product Performance …
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AC vs. DC Coupling Energy Storage Systems — Mayfield …
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